Ipc jedec j-std-033

SMDs are connected using a process known as reflowing, during which the solder connections of the SMD are heated until they liquefy and flow. This revised standard allows the use of both types of HIC cards in dry packs. Cancel reply to comment. In certain situations, however, reversible HICs can fail to indicate actual humidity exposures.

Uploader: Shaktiramar
Date Added: 6 January 2016
File Size: 21.77 Mb
Operating Systems: Windows NT/2000/XP/2003/2003/7/8/10 MacOS 10/X
Downloads: 25311
Price: Free* [*Free Regsitration Required]





These reversible HICs have a good track record of reliability when dry packs remain properly sealed and undamaged. Attach a label to track the times the bag has been opened, just in case you need to bake the PCB's. Clear indication of exposure to high humidity is critically important for SMDs with high moisture sensitivity Level 2 or greater, as defined in J-STD You must have JavaScript enabled in your browser to utilize the functionality of this website.

Because moisture sensitivity depends on several factors and can vary so widely, it's not possible to give generic guidance on assigning MSL levels that has any real value.

Assuring the Integrity of Moisture-Sensitive Surface-Mount Devices (SMDs)

Your PCB supplier will be able to provide you with this information. To make matters worse, damage can occur that affects the long-term reliability of the assembly that is not easily detected with post-assembly testing.

Fahrenholtz about his research, and how he uses Phase Equilibrium Diagrams within it. A Circuitnet Media Publication. Without it, they could unknowingly accept SMDs that have been irreparably damaged by moisture during storage or transit.

Access Denied

In particular, they have asked for an updated HIC that could provide a more complete history of exposure to moisture and SMD integrity within dry packs. Level Measurement for the Food and Beverage Industry. This revised standard allows the use of both types of I;c cards in dry packs.

Grounding Mats Benchtop grounding mats available in rubber and vinyl. The base laminate material type The thickness and layer count of the design The construction specifics, such as PTH aspect ratio, amount of copper plane area, what types of copper, surface treatments, etc.

k-std-033

In certain situations, however, reversible HICs can jefec to indicate actual humidity exposures. Our price is lower than the manufacturer's "minimum advertised price.

Sensitivity can vary quite widely, with thin Kapton flex designs being very sensitive and some FR4 designs being quite moisture-insensitive. Private Feedback to AZoM. After this, they cool and create solid bonds with a substrate, for example a printed circuit board.

The moisture sensitivity of printed board design will depend iipc the resin system. Type 2 cards must be kept in their original manufacturer packaging i. With this, a transparent dry pack bags should be used to control and limit humidity within the transport and storage period.

No MSL is required.

Cancel reply to comment. Tell Us What You Think Do you have a review, update or anything you would like to add to jpc article? Users of the new Type 2 non-reversible cards will find that they can be handled and used in the same way as Type 1 cards, with one exception: JSTD is specific to surface mount devices.

Moisture Sensitivity Level for Bare Boards

This information has been sourced, reviewed and adapted from materials provided by Clariant Corporation. Humidity Indicator Cards HICs are printed with moisture sensitive spots which respond to various levels of humidity with a visible color change from blue to pink. The best guidance one can give is to be conservative and specify that all raw PWBs are handled and stored in such a way as to ensure that they are dry coming to the assembly line, and that there are not unusual delays between processes.

One particularly important, and sensitive element of this supply chain involves the transport, protection and storage of moisture-sensitive surface mount devices, known as SMDs. Usually the bare boards can be packed in pink wrap with desiccant to protect them against moisture. Alternatively, they might approve SMDs that have not been sufficiently heat-dried for processing.

To allow for the inevitable ambient exposure during normal assembly and processing at the user, the printed board fabricator should ensure that moisture content is below the MAMC before placing the printed board into protective packaging.

3 thoughts on “Ipc jedec j-std-033”

Leave a Reply

Your email address will not be published. Required fields are marked *