As an international company with global customers we feel responsible for the progress in standardisation by implementing latest technologies and converting them into standard product platforms. The contact grid in figure 6a is 2. Subracks, cases and cabinets are structural parts of any equipment.
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Open the catalogue to page 9. Open the catalogue to page 7. Introduction to the Standards Summary Why is Schroff committed to standards and modular concepts? The printed board dimensions are specified in IEC As an international company with global customers we feel responsible for the progress in standardisation by implementing latest technologies and converting them into standard product platforms.
Open the catalogue to page 4. The figure below shows a typical 6 U board.
Figure 6a Pitch line Front view Pitch line Reference lines for fixing points of the backplanes to the subrack First position of the connectors of IEC and series contact row b First position of the connectors of IEC series The connectors of the above described IEC series fit on the backplane within the same slot width but with different reference dimensions of the contact grids to the pitch line.
The subrack by the standard. Open the catalogue to page 2. Open the catalogue to page 5. Subracks, cases and cabinets are structural parts of any equipment.
The printed board dimensions are defined as the The thickness of a board is, if nothing specifically Printed board base of the Eurocard form factor required 1. Time-to-market and development expenses of an electronic device force application engineers to use off-the-shelf products rather than design proprietary packaging solutions.
The Online Industrial Exhibition. The height dimension Open the catalogue to page In order to keep the cost low and at the same time maintain a very schrlff quality level, standard designs with predefined performance levels are indispensable.
Commercial electronic devices are investments with relatively long life cycles, where high reliability and availability are predominant requirements. The standards philosophy allows short development time and fast market introduction for these products without expensive development, Mechanical Structures for Electronics Equipment 1.
The contact grid in figure 6a is 2. Open the catalogue to page 3.
Mounting grid for front panels: The width over the mounting flanges is Recently developed Electronics Packaging standards comprise dimensional specifications cztalogue - on a higher level - the criteria for physical integrity, electromagnetic compatibility and thermal management.
Standardisation Summary - a Guide Through International Standards for Electronics Packaging IEC standards The globalisation of the commercial electronics market creates a demand for internationally valid standards.
Thicker boards are possible but need to be agreed between contracting parties.
If two part connectors are used the increased thickness shall be opposite to the reference plane of the board Ref.